Getting ready to replace the stock cooler on the X10SDV-TLN4F with the CoolJag BUF-E and transferred the original screws to the new heatsink.
I read about people using thermal paste or the stock TIM from the BUF-E with mixed results. While the decrease in cooling could be traced to the less powerful replacement fan (usually noctuas), the optimal way of interfacing the cpu/heatsink is not very obvious. In this stage I am not factoring the cooling from whatever fan+duct is employed, just the transfer efficiency from cpu to heatsink.
The TIM on the replacement heatsink seems to have the same size as the one found on the stock cooler (~25x25mm). On the other hand, the cpu heat spreader of the 1541 is ~33x30mm so removing the original interface material and using fresh thermal paste on the whole surface should yield better results. Also, the BUF-E has etched grooves around the TIM and switching to paste would remove the slightly extra height* and help make better contact between the two surfaces.
(*) The thermal pad on the BUF-E is thin but I doubt that, under pressure, would spread better than Arctic MX-2 and also fill the grooves.
Regarding tightening force -- on the stock heatsink the screws cannot be tightened past the point of the retention groove making contact with the motherboard. The same should be true for the custom cooler since the width of the BUF-E's baseplate seems to match the one from the stock heatsink. I didn't use the plastic washers found on the supermicro heatsink, will see how it goes after deciding on the thermal interface.
Any comments or suggestions?