Minisforum MS-01 PCIe Card and RAM Compatibility Thread
- Thread starter Patrick
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The 22110 is a larger enterprise card I'm not sure how the extension board would help him
He won't be able to use his 3 2210 because of the nvme fan with the ext board it wont block the fan. Sorry meant to say replace his 1/2 of his 22110 with 2230 2242 etc.
I also dont have problems with this disk but once i wanted to copy something from a Samsung 980 to it (400GB vm) and during the transfer the 980 died.... i touched the 980 and i wasnt able to even touch the chip on it.... the nvme just shuted down from temperature!!!!! . After a reboot the nvme was fine but bottom line is that 3 disks in that thing if you push them its not OK.
At this moment i have thoughts to completely dissasemble the machine and put everything in a SFF box... after all we all bought it i think for the specs of it and not the size that has its caveats as matter heat...
Also the fan design that exists i am not sure that is optimal IMO... instead to bring air directly on the disks from outside, it takes the heat from above the nvme's and takes it out of the front of the machine... i dont know if this is optimal
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i meant gen4 x4. On your pic you can see that you can remove spacer on 2280 size to fit a 22110 on gen3 ports.
On the gen4 port you can't the spacer is not removable.
Completly agee with you. The specs are good but thermal design is awful. I would have made the case 3 or 4 cm thicker to have a much better airflow.
Yeah I asked via the website and they said shipping end of April, direct from Hong Kong which may or may not be an issue for import taxes depending on how they do it - will wait for now for stock to improve - better if they stock Amazon somewhere in Europe and you can be certain on taxes.
I found a solution i think... we can raise a bit with spacers the case and with the inside metal bracket and the fan out we can put a fan underneath the box to throw air inside....
I will buy an 120x15mm 5v fan and i will get power from a usb port....
eventually these high performance small boxes will all come with fully perforated cases, and one or two standard casefans mounted outside the case. Anything else is stupid and non-viable. It's pure stupidity to try to cram all these hot components into a small closed space, and then start crying about thermal issues.
Also i feel a little neglected regarding the SFP+ issues reported earlier. I posted a link to a reddit post on how to individually disable ASPM for the nic's only. It might be a mandatory thing to do, If the aim is to run 2x10GB links reliably, while having low total wattage.
Also to the user having issues with NIC bonding on the SFP+ ports, my experience with multipath iscsi says flow control is essential for reliable bonds. I hope someone would test my theory. Disable ASPM, and enable flow control on the switch ports.
Also to the user having issues with NIC bonding on the SFP+ ports, my experience with multipath iscsi says flow control is essential for reliable bonds. I hope someone would test my theory. Disable ASPM, and enable flow control on the switch ports.
Damn this think is super efficient ... with all my VM's on it of my HomeLab and passthrough an Nvidia GT730 and the Onboard Usb3 for my Personal VM, i never goes above 80w and normal it sits at ~45w.
I tried this and ASPM was disabled in bios and on kernel. I also tried removing bond and running just a single nic and same issues. I didn’t try the flow control however, when I get the new machine. for now I’m going to stop pulling my hair out and stick with Debian 6.1 because I have less packet drops, no issues bonded issues and it’s been working flawlessly for 3 days. ( without disabling anything )
thanks for your input btw