@dazagrt
I'm sure we all know that heat transfer is directly proportional to the surface area size in contact to heat.
Let's say your hollow cube is soldered to the die on bottom side and to the case on top side.
So bottom side is closer to cpu temp. and top side is close to box temp.
How heat goes from bottom side to top side of the cube, it climbs the thin walls and the thin walls have a very small total area of contact with heat in bottom side and the same small area of contact to top cold side.
Now increase the thickness of the walls, the total area of contact increases, therefore heat transfer increases.
Increase it the max you can and you have the best case scenario a solid cube.