The v3 has a finned aluminum heat sink base for better heat dissipation. (Device v.3.0 on the label)Anyone know what the difference is between the EWS377AP HW versions?
Unfortunately, many sellers post the stock Engenius v1 photos without the finned heat sink.
I coud not discern any differences from their FCC filings. Maybe a rev of the QCOM chip or board layout differences.