Hey all, trying to swap a Intel Scalable 3647 LGA proc that I have mated to a Dynatron B5 heatsink. How in the heck do I do this, first time noobie here on a replacement for scalable. I ran it good n hot w/ a CentOS VM running stress and all cores assigned for a couple hours then shutdown system thinking I could just gentle lift clips/press up but it seems to be tougher than that, cant get compound to break seal. Should the proc unclip/be taken out first or carrier and all and THEN pop out/replace proc?
Also any tips of heatsink compound application I would greatly appreciate, not a whole lot out there for this on LGS3647 that I can find, maybe it's as simple as make your 'BB pellet sized dab on 2011' is close enough but just put more (2-3x's more). Any strategies/best practices arnd this are again appreciated.
QUICK, proc is cooling down haha
TIA, whitey
Also any tips of heatsink compound application I would greatly appreciate, not a whole lot out there for this on LGS3647 that I can find, maybe it's as simple as make your 'BB pellet sized dab on 2011' is close enough but just put more (2-3x's more). Any strategies/best practices arnd this are again appreciated.
QUICK, proc is cooling down haha
TIA, whitey
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