take attantion to the BATCH of the processors, got these 8124Ms for $150 usd each.
L039 = manuf.date 2020, KW 39
Xeon Platinum P-8124 & ASROCK EPC621D8A
- Thread starter iamnypz
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L039 = manuf.date 2020, KW 39
Did some Google and eBay image searching. I couldn't find any P-8136 manufactured outside of 2016. I did find P-8124 for 2016 and 2017. P-8136 appears to have been manufactured exclusively in 2016. That makes sense being it was in production prior to H0 stepping and official release of SKX. Unlike the 8124M, there was no reason to manufacturer P-8124 or P-8136 after H0 was released.
Got a Platinum P-8124 from iamnypz with temp.problems, some cores went up to 107C even without turbo active.
after delidding(special thanks to gb00s for providing the WS 3647) the issue was apparently, totaly dried out thermal paste.
the surface is too big for me to use liquid metal, it runs everywhere but you can't view under the IHS.
reTIMed with MX-5 i got temps at 65C-70C degree under cbr20 load.
I will keep an eye out for temps if I can get everything else working... I'm less worried about crusty old thermal paste and more worried about general compatibility / stability.
Apparently I have too much free time today as I wait on my boards and chips...
The screenshot shows errors on two PCIe devices - 8086:37c0 (PCI bridge) and 8086:2031 (Sky Lake-E PCI Express Root Port B).
Those devices are present on lots of boards with the C621 chipset, including many Supermicro motherboards, but interestingly are not present on X11SPL-F. What does that mean for me? Who knows!
Good News: CPU's arrived. Manufacturing dates are Week 1 of 2017 (2x are identical batch) and Week 45 of 2016. Condition is grade A. They almost look like spares. There aren't any scratches or marks from a cooler, zero old thermal paste anywhere, including in the two vent holes on the IHS that are impossible to fully clean out... they look like a brand new chip.
Bad News: Swapped the motherboard in first chassis. The X10DRi-LN4+ is a massive EE-ATX which extended closer to the PDU. The new X11SPL-F is an ATX board. The 24-pin ATX power cable isn't long enough. I won't be making any further progress today.
Bad News: Swapped the motherboard in first chassis. The X10DRi-LN4+ is a massive EE-ATX which extended closer to the PDU. The new X11SPL-F is an ATX board. The 24-pin ATX power cable isn't long enough. I won't be making any further progress today.
P-8124(some cores 107C) delidded with WS 3647(der8auer)just clean it: i have removed the black high-temp.silicone only on the IHS and used MX-5
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sanded ? one thing what never be done thought. foreign atoms could migrate into the silicon and destroy the chip over time.
With very rare and limited exception, Intel CPU’s topped out at 165W TDP prior to SKX. The jump up to 240W is significant. I suspect the long term failures of thermal paste and some cores in P-8124 are related to engineering larger power draw CPU. Also possible cooling for the hotter chip at Amazon or wherever was inadequate. I haven’t had these problems with the P-8136 at 165W.
only custom OEMs
goes in hand with the high core frequency, the frq/draw courve in not linear.
time is money, they don't care.don't wait for failure, just replace after X month and go...
lower frequencies.
have a Microsoft(Azure) Olympus dual 3647 motherboard, it has two BIOSs - one includes B1 microcode.