One of my friends got one of this. We both don't know what is it. It looks like a GPU but Ponte Vecchio is more of a rectangular shape than a squire, it also looks like a Stratix FPGA but the IHS is different. Does anyone know what it is?
What is this thing
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Intel Xeon 6710E 64 core server CPU
www.intel.com
P.S. Probably should not have it resting on cardboard if you want to prevent static discharge from damaging it. Follow ESD handling procedures.
Intel® Xeon® 6710E Processor (96M Cache, 2.40 GHz) - Product Specifications | Intel
Intel® Xeon® 6710E Processor (96M Cache, 2.40 GHz) quick reference with specifications, features, and technologies.
www.intel.com
P.S. Probably should not have it resting on cardboard if you want to prevent static discharge from damaging it. Follow ESD handling procedures.
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i guess just a substrate/heatspreader sample(dummy) because nothing printed on it.t looks like a GPU but Ponte Vecchio is more of a rectangular shape than a squire, it also looks like a Stratix FPGA but the IHS is different. Does anyone know what it is?
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there is ESD floor covering, ESD plastics, ESD foam, and of course ESD cardboard material.
btw: a aluminium plate is not ESD (but anti static)
As @RolloZ170 is pointing out in a post above - most likely Intel Ponte Vecchio GPU (SOC)
Not a CPU, doesn't match any of AMD versions I've seen
Upper one (no label) looks like (FC)LGA 4K-5.5K range (88x62 array)
has too low pin count for LGA 7529 (although capacitor area is symmetric too) and doesn't match the shape of LGA 4710
p.s./added: moreover - contact area looks like is designed for soldering (balled, etc., round contacts), not for socket installation.
Not a CPU, doesn't match any of AMD versions I've seen
Upper one (no label) looks like (FC)LGA 4K-5.5K range (88x62 array)
has too low pin count for LGA 7529 (although capacitor area is symmetric too) and doesn't match the shape of LGA 4710
p.s./added: moreover - contact area looks like is designed for soldering (balled, etc., round contacts), not for socket installation.
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It's just physics and engineering efficiency with balled soldering chips installs, when ball of solder melts - it's most efficient to take a round form over any other (because of "surface tension", cohesion, wetting, molecular gravity).
With multi-installation solderless LGA sockets - shape of contact is more efficient to have a form of rectangle aligned with moving clearance direction of contacting spring.
Although anyone is free to cut the corners from the original design (and solder-install CPUs on MB) if they have other priorities in mind and sacrifice some best practices for those at their own risk (and have a bit higher failure rates due to risks materializing with selected manufacturing/assembly process)
With multi-installation solderless LGA sockets - shape of contact is more efficient to have a form of rectangle aligned with moving clearance direction of contacting spring.
Although anyone is free to cut the corners from the original design (and solder-install CPUs on MB) if they have other priorities in mind and sacrifice some best practices for those at their own risk (and have a bit higher failure rates due to risks materializing with selected manufacturing/assembly process)