LGA 4677?

[111alan]

I think many of you have seen the LGA4189 Ice Lake-SP picture posted by my friend, but here's an LGA4677 Sapphire Rapids(SP?) CPU. Can't delid now cause it's not mine.

 

[alex_stief]

Banana for scale please

 

[111alan]

Banana for scale please

I just got a look, no other pictures taken. It seems that it's about the same size as LGA4189, but it has at least 2 dies, more pins and a different capacitor layout.

 

[Patrick]

May want to remove the confidential markings before posting those.

 

[111alan]

May want to remove the confidential markings before posting those.

Thx for the reminder, I asked the one who have these and leaked that 14core icelake before and he said it's ok not to cover anything.

 

[Syr]

LGA4677 has a considerably different layout though (See attached diagrams - src: diagrams on imgur extracted from TE's documentation).

Those extra pads (The smaller, circular ones) are not primary data or power pads, but are used for auxiliary/debug functionality, such as fine-grained input power tuning, QC, or debugging. Intel does not include those pads in the LGA designation - only the primary pads.
IF this is sapphire rapids, it could be a very early sample not designed for production use, or for a specialized platform, however I strongly suspect this is not the case.

Rather, I think its probable that this is one of the MCM cooperlake chips (up to 56c per socket on the whitley platform) that was supposed to launch early this year but were suddenly canceled. Other known examples of cooperlake ES chips have those extra pads, both on cedar & whitley. The attached photos are of a cedar isles platform cooperlake xeon ES that was delidded (src: bilibili user yuuki_ans via leak finder momomo_us on twitter). Note that it too has all those extra pads.

 

[111alan]

LGA4677 has a considerably different layout though (See attached diagrams - src: diagrams on imgur extracted from TE's documentation).

Those extra pads (The smaller, circular ones) are not primary data or power pads, but are used for auxiliary/debug functionality, such as fine-grained input power tuning, QC, or debugging. Intel does not include those pads in the LGA designation - only the primary pads.
IF this is sapphire rapids, it could be a very early sample not designed for production use, or for a specialized platform, however I strongly suspect this is not the case.

Rather, I think its probable that this is one of the MCM cooperlake chips (up to 56c per socket on the whitley platform) that was supposed to launch early this year but were suddenly canceled. Other known examples of cooperlake ES chips have those extra pads, both on cedar & whitley. The attached photos are of a cedar isles platform cooperlake xeon ES that was delidded (src: bilibili user yuuki_ans via leak finder momomo_us on twitter). Note that it too has all those extra pads.

Thought about this several days ago, forgot to update. The distance between dies are a little too long for an EMIB bridge. I remember CPX-AP isn't canceled though, rather it's an OEM-only config. Seems that Facebook is using this kind of things.