Hello, I'm a mechanical engineer and recently I've been trying to map the evolution of the heat flux dissipated by micro chips. This calculation is based on the ratio between TDP/Die Area (W/m^2). However, for recent products there is little information, especially with regard to the Die Area. Does anyone have any idea why it's so hard to find this technical information?
Intel lack of information
- Thread starter Xande96
- Start date
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- Tags
- die especifications heat flux power
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