Chassis is a SM 512. MB is a X9SCI-LN4F.
The MB power cable bundles coming out of the PSU poke up beyond the top of the chassis. In order to get the top on I have to put considerable pressure on it to push the bundles down. Problem is, the system won't boot with the lid on. I think it's because the bundle is pushing against the memory when the lid is on. The bundles, main and 8 pin are too stiff to wedge in between the PSU and MB plus the space is just not big enough. The chassis is correct for the MB so either I'm missing something here or this is a piss poor design. Either way I need to get it working with the lid on.
Any suggestions much appreciated.
The MB power cable bundles coming out of the PSU poke up beyond the top of the chassis. In order to get the top on I have to put considerable pressure on it to push the bundles down. Problem is, the system won't boot with the lid on. I think it's because the bundle is pushing against the memory when the lid is on. The bundles, main and 8 pin are too stiff to wedge in between the PSU and MB plus the space is just not big enough. The chassis is correct for the MB so either I'm missing something here or this is a piss poor design. Either way I need to get it working with the lid on.
Any suggestions much appreciated.